BUDOVICH, L. S. Innovations in Marketing of Printed Circuit Board Assembly by Optimization Techniques for Enhanced Performance. International Journal of Industrial Engineering and Management, [S. l.], p. article in press, 2024. DOI: 10.24867/IJIEM-2024-4-363. Disponível em: https://ijiemjournal.uns.ac.rs/index.php/ijiem/article/view/1403. Acesso em: 24 nov. 2024.